Jenmat consults in many areas of electronic manufacturing technology, with an emphasis in solder assembly and microassembly. We have extensive experience in the electronics manufacturing industry, with an emphasis on design for adverse environments. Jenmat is available for on-site problem solving overseas.
Our experience in solder technology is broad, and includes some unusual processes. Board assembly (thru-hole and surface-mount) is just the beginning. We can supply the process expertise for everything from soft substrate attach to microwave lumped-element filter assembly in planar housings. From vapor phase reflow to termination analysis, Jenmat is ready to solve your most difficult solder problems and write your processes.
Our microassembly background is really focused on hermetic hybrid production. We can provide process engineering support and documentation for most hybrid processes. We'll help you select the right materials and assembly equipment to meet your requirements and satisfy your customers. Wirebonding and interconnect welding processes are second nature to us. We've put over 1000 different hybrids into production, from travelers and die-attach through laser sealing and marking.
Jenmat conducts failure analysis as part of our service offering. We contract for SEM, EDXS, microscopic and stress testing at facilities near us in San Diego. We also offer screening, including burn-in, temp-cycle, and humidity testing.
Jenmat can accomodate your quality system, including most government standards such as MIL-H-38534, MIL-Q-9858 or MIL-STD-883, and commerical/global standards such as ISO-9002 and IPC. Jenmat can generate process documentation that meets your requirements. For Instructional Documentation, please view the Technology Partners page.